CAMERA MODULE, SOLID-STATE IMAGING DEVICE, AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Aug 7, 2014
app pub date -
Aug 23, 2013
filing date -
Feb 4, 2013
priority date (Note) -
Abandoned
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Abstract
According to an embodiment of the present invention, a solid-state imaging device is provided. The solid-state imaging device includes a plurality of photoelectric conversion devices and an amplifier transistor. The plurality of photoelectric conversion devices photoelectrically converts an incident beam into signal charges. The amplifier transistor is provided on a face on the opposite side of the light incidence plane of the photoelectric conversion devices through an interlayer insulating film as the amplifier transistor is laid over the photoelectric conversion devices. The amplifier transistor has the area of a channel greater than the area of the incidence plane of a single photoelectric conversion device, and the amplifier transistor amplifies the signal charges.
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