Method of making wire bond vias and microelectronic package having wire bond vias

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United States of America Patent

PATENT NO 8940630
APP PUB NO 20140220744A1
SERIAL NO

13757673

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Abstract

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Microelectronic components and methods forming such microelectronic components are disclosed herein. The microelectronic components may include a plurality of electrically conductive vias in the form of wire bonds extending from a bonding surface of a substrate, such as surfaces of electrically conductive elements at a surface of the substrate.

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Patent Owner(s)

  • INVENSAS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chau, Ellis San Jose, US 43 2297
Damberg, Philip Cupertino, US 52 1295
Zhao, Zhijun San Jose, US 17 397

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