SURFACE SELECTIVE POLISHING COMPOSITIONS

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United States of America Patent

APP PUB NO 20140220779A1
SERIAL NO

14170365

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The disclosure provides polishing compositions that show a high polishing rate ratio of a silicon nitride (SiN) surface to a silicon oxide surface, and/or of a SiN surface to a polycrystalline silicon (Poly Si) surface. Such compositions comprise, in certain aspects, of colloidal silica, and one or more water soluble polymers, and has a pH of 6 or less, wherein the colloidal silica comprises one or more organic acids bound to its surface, and the water soluble polymer is a polyoxyalkylene hydrocarbyl ether which hydrocarbyl moiety has 12 or more carbon atoms.

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Patent Owner(s)

Patent OwnerAddress
FUJIMI INCORPORATEDKIYOSU-SHI AICHI 452-8502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Hooi-Sung Tualatin, US 10 18
Miller, Anne Tualatin, US 14 434

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