COMPOSITE MATERIAL

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United States of America Patent

APP PUB NO 20140221548A1
SERIAL NO

14343514

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a composite material which can be preferably used as alternative seal materials to asbestos seal materials or as a heat dissipation sheet with excellent thermal conductivity. The composite material comprises: (1) an inorganic filler-containing material containing an inorganic filler and any of the following: a polyimide film, a polyimide varnish consisting of a polyamide acid solution, an incompletely-imidized and self-standing polyimide precursor film obtained by drying a polyamide acid solution, a polybenzimidazole film, a varnish consisting of a polybenzimidazole solution, a polyazomethine film, a mixed film consisting of a polyimide resin and a polybenzimidazole resin, a mixed varnish consisting of a polyamide acid solution and a polybenzimidazole solution, a mixed film consisting of a polyimide precursor and polyazomethine, a polybenzoxazole film, etc; and (2) a molding consisting of any of expanded graphite, organic fiber and inorganic fiber.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO SEIKA CHEMICALS CO LTDJAPAN HYOGO PREFECTURE HYOGO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bando, Seiji Hyogo, JP 18 168
Ebina, Takeo Miyagi, JP 27 107
Fujihara, Koji Osaka, JP 1 1
Iwamoto, Takuya Osaka, JP 36 185
Nakamura, Yuzo Osaka, JP 33 266
Tsukamoto, Katsuro Osaka, JP 27 85

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