MOLDING MATERIAL

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United States of America Patent

APP PUB NO 20140221568A1
SERIAL NO

14232064

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provision of a molding material excellent in molding accuracy without using a silicone resin and suitable for use in producing a molded body having high hardness and excellent appearance; a resin film formed from the molding material; a molded body obtained by using the molding material as a starting material; and a method for producing the molded body. A molding material used as a starting material in producing a molded body, containing a (meth)acrylic resin emulsion, a polyfunctional (meth)acrylic acid ester and a polymerization initiator; a resin film formed from the molding material; a molded body including a substrate and a molding material layer formed on the substrate wherein the molding material layer is formed from the molding material; and a method for producing the molded body.

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Patent Owner(s)

Patent OwnerAddress
NIPPON SHOKUBAI CO LTDOSAKA JAPAN OSAKA

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akutagawa, Hironobu Suita-shi, JP 4 18
Kikuta, Teruo Suita-shi, JP 8 110
Nakao, Kanji Suita-shi, JP 8 104
Namimoto, Fuyuko Suita-shi, JP 4 5

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