Method for producing electronic component
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United States of America Patent
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May 16, 2017
Grant Date -
Aug 14, 2014
app pub date -
Dec 27, 2013
filing date -
Feb 8, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A method for producing an electronic component including a laminate, a circuit element provided therein, and external conductors electrically connected thereto. The method including steps of obtaining a mother laminate that has a plurality of the laminates arranged in a matrix-like state in a first direction and a second direction perpendicular thereto. The mother laminate is cut into the laminates. In the step of obtaining, the mother laminate is obtained such that the external conductors of two laminates adjacent in the first direction are joined, and circuit elements provided in the two laminates have a point-symmetrical relationship with each other. In the step of cutting, the mother laminate is cut along first cutoff lines extending in the second direction after the mother laminate is cut along second cutoff lines extending in the first direction. The external conductors are located on corresponding first cutoff lines.
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