PRECURSOR SUBSTRATE, FLEXIBLE CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME
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United States of America Patent
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Issued Date -
Aug 14, 2014
app pub date -
Mar 28, 2013
filing date -
Feb 8, 2013
priority date (Note) -
Abandoned
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Abstract
The present invention provides a flexible circuit board, comprising at least a multilayer unit disposed on a substrate, wherein the multilayer unit includes: an adhesion enhancing layer formed within the surface of the substrate, a first electrical conducting unit disposed on the adhesion enhancing layer, and a second electrical conducting layer formed on the first electrical conducting layer, wherein the adhesion enhancing layer is Palladium, the first electrical conducting layer is Nickel, and the substrate is composed of polyimide(PI).
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