Method for machining a through-hole in a component and machining device for implementing the said method
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United States of America Patent
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Jul 5, 2016
Grant Date -
Aug 14, 2014
app pub date -
Feb 12, 2014
filing date -
Feb 13, 2013
priority date (Note) -
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Abstract
A method for machining a through-hole in a wall of a component, includes setting in rotation on itself a cutting tool about a rotation axis and setting the rotation axis of the tool in rotation about a first orbital rotation axis parallel to, and eccentric by an eccentricity E with respect to, the rotation axis of the tool. The method further includes setting the first orbital rotation axis in rotation, over at least one revolution, about a second orbital rotation axis parallel to, and eccentric by an amount f with respect to, the first orbital rotation axis, the eccentricity being fixed. This configuration makes it possible to balance the elements located between the rotation axis of the tool and the first orbital rotation axis, so that the rotation axis can thus be set in rotation about the first orbital rotation axis at high rotational speeds that contribute toward increasing productivity.
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