Multi-Finish Printed Circuit Board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140231127A1
SERIAL NO

13770467

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A multi-finish printed circuit board may include one or more electrically conductive elements, such as through hole pads, that may have a first surface finish and one or more electrically conductive elements, such as surface mount pads, that may have a second surface finish that is different from the first surface finish. The first surface finish may be a hot air solder leveling (HASL) surface finish or a lead-free hot air solder leveling (LF HASL) surface finish and the second surface finish may be an organic surface protector (OSP) surface finish. The second surface finish may be applied to one or more electrically conductive elements from which the first surface finish was removed.

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Patent Owner(s)

Patent OwnerAddress
LUTRON TECHNOLOGY COMPANY LLC7200 SUTER ROAD PATENT DEPT COOPERSBURG PA 18036

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Manero, David Perkasie, US 1 5

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