Multi-Finish Printed Circuit Board
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United States of America Patent
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N/A
Issued Date -
Aug 21, 2014
app pub date -
Feb 19, 2013
filing date -
Feb 19, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A multi-finish printed circuit board may include one or more electrically conductive elements, such as through hole pads, that may have a first surface finish and one or more electrically conductive elements, such as surface mount pads, that may have a second surface finish that is different from the first surface finish. The first surface finish may be a hot air solder leveling (HASL) surface finish or a lead-free hot air solder leveling (LF HASL) surface finish and the second surface finish may be an organic surface protector (OSP) surface finish. The second surface finish may be applied to one or more electrically conductive elements from which the first surface finish was removed.
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