Importance

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Abstract

A film member includes a substrate formed of a resin film and an aluminium oxynitride film arranged on either, front or back sides of the substrate, in which the aluminium oxynitride film is composed of 39 at % to 55 at % of Al, 7 at % to 60 at % of O, and 1 at % to 50 at % of N. A method for producing the film member includes a pressure reduction step of arranging a substrate in a chamber of a sputtering deposition system such that the substrate faces a target made of aluminium and a deposition step of introducing a source gas including nitrogen and a carrier gas into the chamber and forming the aluminium oxynitride film on a deposition surface of the substrate in an atmosphere in which a ratio of an oxygen gas pressure to a nitrogen gas pressure in the chamber is not more than 20%.

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First Claim