Semiconductor grid array package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9209081
APP PUB NO 20140231980A1
SERIAL NO

13773603

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A semiconductor grid array package has a first housing member with a cavity that has a cavity floor and cavity walls. A semiconductor die is affixed to the cavity floor. A second housing member is molded to the first housing member and covers an interface surface of the die. Electrically conductive runners are mounted to an external surface of the second housing member. The runners have a wire contacting area and an external connector contacting area. Bond wires are selectively bonded to the external connection pads of the semiconductor die and selectively connected to the wire contacting area of the runners. External electrical connectors are mounted to a designated external connector contacting area.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • NXP USA, INC.;THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lim, Fui Yee Bandar Sri Damasara, MY 4 35
Yap, Weng Foong Phoenix, US 16 136

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jun 8, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00