Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device

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United States of America Patent

PATENT NO 9484240
APP PUB NO 20140231983A1
SERIAL NO

14183823

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Abstract

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The present invention provides a film adhesive that can prevent a thermal effect to a semiconductor wafer and that can suppress warping of the semiconductor wafer; a dicing tape with a film adhesive; and a method of manufacturing a semiconductor device.

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Patent Owner(s)

  • NITTO DENKO CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kimura, Yuta Ibaraki, JP 29 334
Sugo, Yuki Ibaraki, JP 47 150

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