Ductile mode machining methods for hard and brittle components of plasma processing apparatuses
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United States of America Patent
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Nov 25, 2014
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Feb 20, 2013
filing date -
Feb 20, 2013
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Abstract
A method of ductile mode machining a component of a plasma processing apparatus wherein the component is made of nonmetallic hard and brittle material wherein the method comprises single point turning the component with a diamond cutting tool causing a portion of the nonmetallic hard and brittle material to undergo a high pressure phase transformation to form a ductile phase portion of the hard and brittle material during chip formation wherein a turned surface is formed from a phase changed material and the turned surface is a grooved textured surface of phase changed material.
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