Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding
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United States of America Patent
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Jan 5, 2016
Grant Date -
Aug 21, 2014
app pub date -
Apr 24, 2014
filing date -
Sep 28, 2011
priority date (Note) -
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Abstract
Embodiments of provide an integrated circuit (IC) device. The IC device can include a substrate having first and second opposing surfaces, an IC die electrically coupled to the first surface of the substrate, a plurality of contact members coupled to the first surface of the substrate, and an interposer. The interposer can include a plurality of contact elements located on a first surface thereof, each conductive element being coupled to a respective one of the plurality of contact members, and an antenna formed using a conductive layer of the interposer, the antenna being electrically coupled to the IC die through at least one of the plurality of contact elements and at least one of the plurality of contact members.
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