ADHESIVE TAPE CUTTING METHOD AND ADHESIVE TAPE CUTTING APPARATUS
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United States of America Patent
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Issued Date -
Aug 28, 2014
app pub date -
Jan 15, 2014
filing date -
Feb 28, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A strip adhesive tape except for a portion on a notch of a wafer W is cut by contacting a cutter of a first cutting mechanism along an outer periphery of the wafer. The adhesive tape cut out into a wafer shape is reeled and collected while being separated. Thereafter, the wafer with the adhesive tape is transported to a second cutting mechanism. The second cutting mechanism cuts out the portion of the adhesive tape on the notch with a cutter having the same shape as that of the notch.
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