Mold for forming complex 3D MEMS components

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United States of America Patent

PATENT NO 9249015
SERIAL NO

13778526

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Abstract

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A mold structure having high-precision multi-dimensional components includes: depositing an oxide layer on a top surface of a plurality of semiconductor substrates, patterning a design integrated in one or more of the oxide layers; repositioning the substrates to enable the oxide layers make contact with one another; bonding in sequential order the repositioned substrates using a dielectric bonding, forming a three dimension (3D) mold; filling the 3D mold with filling material and removing the overburden filling material present on a top surface of the component.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION;YALE UNIVERSITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kinser, Emily R Poughkeepsie, US 66 597
Kumar, Golden Lubbock, US 9 72
Schroers, Jan Hamden, US 45 492

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