Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s)
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United States of America Patent
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Nov 15, 2016
Grant Date -
Aug 28, 2014
app pub date -
Feb 27, 2013
filing date -
Feb 27, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader and at least one coolant-carrying channel associated with the thermal spreader to facilitate removal of heat from the thermal spreader to coolant flowing through the coolant-carrying channel(s). The cooling apparatus further includes a coolant manifold structure disposed adjacent to a socket of the electronic system within which the electronics card operatively docks, and a fluidic and mechanical attachment mechanism which facilitates selective, fluidic and mechanical coupling or decoupling the thermal transfer structure and coolant manifold structure, the attachment mechanism facilitating the flow of coolant between the coolant manifold structure and the coolant-carrying channel(s) of the thermal transfer structure.
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