HIGH-SPEED OPTICAL RECEIVER MODULE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Aug 28, 2014
app pub date -
Feb 14, 2014
filing date -
Feb 27, 2013
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Abstract
Provided is a photoreceiver module. The module includes: a ceramic substrate formed by stacking a plurality of metallic layers and a plurality of ceramic layers; a high frequency transmission line formed on the ceramic substrate and configured to transmit a high frequency electrical signal; a photodetector mounted on the ceramic substrate and configured to convert the high frequency electronic signal; a power supply line supplying DC power to the photodetector; and a high frequency connector connected to the high frequency transmission line and configured to deliver the high frequency electrical signal to an outside. The photodetector is mounted on a stepped hole manufactured in the ceramic substrate, and a height of each contact point of the photodetector and the high frequency transmission line is corrected by the stepped hole.
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