MULTI-LAYER MICRO-WIRE STRUCTURE
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United States of America Patent
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Issued Date -
Aug 28, 2014
app pub date -
Feb 28, 2013
filing date -
Feb 28, 2013
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Abandoned
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Abstract
A multi-layer micro-wire structure includes a substrate having a surface. A plurality of micro-channels is formed in the substrate. A first material composition is located in a first layer only in each micro-channel and not on the substrate surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the substrate surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
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