Carrier-less silicon interposer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9237648
APP PUB NO 20140240938A1
SERIAL NO

13776035

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Abstract

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An interposer has conductive elements at a first side and terminals at a second side opposite therefrom, for connecting with a microelectronic element and a second component, respectively. The component includes a first element having a thermal expansion coefficient less than 10 ppm/° C., and an insulating second element, with a plurality of openings extending from the second side through the second element towards the first element. A conductive structure extending through the openings in the second element and through the first element electrically connects the terminals with the conductive elements.

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Patent Owner(s)

  • INVENSAS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Caskey, Terrence Santa Cruz, US 43 940
Monadgemi, Pezhman Fremont, US 43 1086
Newman, Michael Dublin, US 67 1722
Uzoh, Cyprian Emeka San Jose, US 330 9256
Woychik, Charles G San Jose, US 106 2139

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