FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION
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United States of America Patent
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Issued Date -
Aug 28, 2014
app pub date -
Oct 1, 2012
filing date -
Oct 5, 2011
priority date (Note) -
Abandoned
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Abstract
The invention relates to an electroless aqueous copper plating solution, comprising a source of copper ions, a source of glyoxylic acid as reducing agent, and at least one polyamino disuccinic acid or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid as complexing agent, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.
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