Packaged integrated circuit devices with through-body conductive vias, and methods of making same

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United States of America Patent

PATENT NO 9099571
APP PUB NO 20140242751A1
SERIAL NO

14273138

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Abstract

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A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chia, Yong Poo Singapore, SG 62 1294
Jiang, Tongbi Boise, US 331 5995

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