Characterization of interface resistance in a multi-layer conductive structure

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United States of America Patent

PATENT NO 9453878
APP PUB NO 20140244202A1
SERIAL NO

13776902

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Abstract

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Disclosed is a test structure that can be used to characterize a specific interface resistance within a multi-layer conductive structure, such as a multi-layer ohmic contact. In the test structure first and second transmission line model (TLM) structures both incorporate a row of essentially identical contact pads separated by spaces with progressively increasing lengths. Conductive mesas, also with progressively increasing lengths, are positioned within the spaces between all but the initial pair of adjacent contacts pads. The first and second TLM structures differ only with respect to the presence of a single conductive layer on each of the conductive mesas. System, method and computer program product embodiments are able to extract resistance parameters associated with the first and second TLM structures, including conductive mesa to conductive layer interface resistances, based current-voltage measurements acquired from both of the TLM structures.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Campi,, Jr John B Westford, US 40 440
Gauthier,, Jr Robert J Hinesburg, US 209 2329
Li, Junjun Williston, US 153 1556
Mitra, Souvick Essex Junction, US 132 1219

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