Importance

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Abstract

The present invention relates to a method of making a cavity substrate. In accordance with a preferred embodiment, the method includes: preparing a supporting board including a stiffener, a bump/flange sacrificial carrier and an adhesive, wherein the adhesive bonds the stiffener to the sacrificial carrier; then attaching an interconnect substrate to the supporting board using a dielectric layer; then removing the bump and a portion of the flange to form a cavity and expose the dielectric layer; and then forming a via opening in the dielectric layer to expose a selected portion of the interconnect substrate. A semiconductor device can be mounted on the cavity substrate and electrically connected to the exposed portion of the interconnect substrate. The interconnect substrate provides signal routing for the semiconductor device while the stiffener can provide adequate mechanical support for the interconnect substrate and the semiconductor device.

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First Claim