INTEGRATED CIRCUIT PROTECTED FROM SHORT CIRCUITS CAUSED BY SILICIDE

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United States of America Patent

APP PUB NO 20140246720A1
SERIAL NO

14194345

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Abstract

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An integrated circuit is formed on a semiconductor substrate and includes a trench conductor and a first transistor formed on the surface of the substrate. The transistor includes: a transistor gate structure, a first doped region extending in the substrate between a first edge of the gate structure and an upper edge of the trench conductor, and a first spacer formed on the first edge of the gate structure and above the first doped region. The first spacer completely covers the first doped region and a silicide is present on the trench conductor but is not present on the surface of the first doped region.

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Patent Owner(s)

Patent OwnerAddress
STMICROELECTRONICS (ROUSSET) SASROUSSET

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
La, Rosa Francesco Rousset, FR 119 736
Niel, Stephan Greasque, FR 48 224
Regnier, Arnaud Les Taillades, FR 48 245

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