Copper nanorod-based thermal interface material (TIM)

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United States of America Patent

PATENT NO 9601406
SERIAL NO

13782893

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Abstract

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A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters.

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Patent Owner(s)

  • INTEL CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eid, Feras Chandler, US 266 926
Gupta, Ashish Chandler, US 257 4170
Jha, Chandra M Chandler, US 16 67
Swan, Johanna M Scottsdale, US 269 1944

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