SEMICONDUCTOR DEVICE HAVING A BUFFER LAYER AND METHOD OF MANUFACTURING THE SAME

United States of America Patent

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Issued Date
Sep 4, 2014
app pub date
Mar 15, 2013
filing date
Mar 4, 2013

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Abandoned

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Abstract

A semiconductor device and method for manufacturing the same are provided. A metal pad can be electrically connected to metal interconnections in a lower portion of the device. A passivation layer can be provided and can exposes a portion of the metal pad, and a buffer layer can be formed on lateral sides of the passivation layer.

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Patent Owner(s)

Patent Owner	Address
DONGBU HITEK CO LTD	SEOUL CITY KOREA SEOUL

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
CHOI, Nam Gon	Seoul, KR	6	27

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SEMICONDUCTOR DEVICE HAVING A BUFFER LAYER AND METHOD OF MANUFACTURING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

13832038

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13832038

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