Semiconductor device, wireless device, and storage device
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United States of America Patent
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Apr 12, 2016
Grant Date -
Sep 4, 2014
app pub date -
Feb 20, 2014
filing date -
Mar 1, 2013
priority date (Note) -
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Abstract
According to one embodiment, a semiconductor device includes a substrate, a first semiconductor chip, a second semiconductor chip, and a discrete element part. The first semiconductor chip is arranged on the substrate and includes a first electrode group. The second semiconductor chip is arranged on the substrate and includes a second electrode group, at least one of electrodes included in the second electrode group being connected to at least one of electrodes included in the first electrode group via at least one bonding wire. The discrete element part is arranged on the substrate and under the at least one bonding wire.
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