MOLDING METHOD AND APPARATUS THEREFOR
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United States of America Patent
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Issued Date -
Sep 4, 2014
app pub date -
Feb 27, 2014
filing date -
Mar 1, 2013
priority date (Note) -
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Abstract
In a molding method and an apparatus for the method, a base material is placed on mounting portions of bottom support pins, which protrude from a first inner surface of a lower mold in an open state. Pressing portions of top support pins, which protrude from a second inner surface of an upper mold, are brought into contact with the base material. Consequently, the base material is sandwiched between the mounting portions and the pressing portions. Thereafter, pre-forming preferably is carried out. For example, the bottom support pins and the top support pins are lowered toward the lower mold, such that the base material is brought into contact with the first inner surface. Then, the lower mold and the upper mold are closed, and the base material is molded into a molded article.
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