Methods for forming a conductive material and methods for forming a conductive structure

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United States of America Patent

PATENT NO 9023711
APP PUB NO 20140248771A1
SERIAL NO

14277507

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Abstract

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A method of forming a conductive material comprises forming at least one opening extending through an organic material and an insulative material underlying the organic material to expose at least a portion of a substrate and a conductive contact in the substrate. The method further comprises lining exposed surfaces of the insulative material, the conductive contact, and the at least a portion of the substrate in the at least one opening with a conductive material without forming the conductive material on the organic material.

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Patent Owner(s)

  • MICRON TECHNOLOGY, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Marsh, Eugene P Boise, US 225 5776

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