Method for improving surface quality of spalled substrates

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9308714
APP PUB NO 20140251548A1
SERIAL NO

13785839

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A compliant material is formed between a base substrate and a support structure prior to performing a controlled spalling process. By positioning the compliant material between the base substrate and the support structure, the localized effects of surface perturbations (particles, wafer artifacts, etc.) on spalling mode fracture can be reduced. The method of the present disclosure thus leads to improved surface quality of the spalled material layer and the remaining base substrate. Moreover, the method of the present disclosure can reduce the density of cleaving artifacts.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bedell, Stephen W Wappingers Falls, US 409 5550
Fogel, Keith E Hopewell Junction, US 270 4155
Lauro, Paul A Brewster, US 85 1916
Sadana, Devendra K Pleasantville, US 897 9950

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 12, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00