COOLING FRAME WITH INTEGRATED HEAT PIPES
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United States of America Patent
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Issued Date -
Sep 11, 2014
app pub date -
Mar 8, 2013
filing date -
Mar 8, 2013
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Abstract
A heat-transfer system is provided for conveying heat from a heat source, the heat-transfer system generally including a frame for coupling to the heat source, wherein the frame is insertable into a first slot of a cooling chassis, and a heat-transfer rail extending parallel to the frame at an offset distance, wherein the offset distance is dimensioned such that the heat-transfer rail is insertable into a second slot of the cooling chassis. At least one heat-transfer device couples the heat-transfer rail to the frame.
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