THERMALLY ENHANCED WIRING BOARD WITH BUILT-IN HEAT SINK AND BUILD-UP CIRCUITRY
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United States of America Patent
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Issued Date -
Sep 11, 2014
app pub date -
Mar 7, 2013
filing date -
Mar 7, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A thermally enhanced wiring board includes a heat sink, a stiffener and a build-up circuitry. The heat sink extends into an aperture of the stiffener and is thermally connected to the build-up circuitry. The build-up circuitry covers the heat sink and the stiffener and provides signal routing for the stiffener. The stiffener provides signal routing and mechanical support for the build-up circuitry.
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