MICRO-CHANNEL CONNECTION PAD
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 11, 2014
app pub date -
Mar 5, 2013
filing date -
Mar 5, 2013
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A connection-pad structure includes a substrate and a cured layer formed in the substrate. A group of intersecting micro-channels is embossed in the cured layer opposite the substrate. Each micro-channel extends from the cured-layer surface into the cured layer toward the substrate; the intersecting micro-channels form a connection pad. An electrically continuous cured electrical conductor forms an electrically continuous micro-wire in the group of intersecting micro-channels and an electrical connector is electrically connected to the cured electrical conductor.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully