Micro-channel connection method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9167700
APP PUB NO 20140251673A1
SERIAL NO

13784893

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method of making a connection-pad structure includes providing a substrate and coating a curable layer over the substrate. A group of intersecting micro-channels is embossed in the curable layer. Each micro-channel extends from a surface of the curable layer into the curable layer toward the substrate. The curable layer is cured to form a cured layer having embossed intersecting micro-channels in the cured layer; the group of intersecting micro-channels forms a connection pad. A curable electrical conductor is located in the intersecting micro-channels. The curable electrical conductor is cured to form an electrically continuous cured electrical conductor formed in the group of intersecting micro-channels and an electrical connector is electrically connected to the cured electrical conductor.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • EASTMAN KODAK COMPANY

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cok, Ronald Steven Rochester, US 217 2094
Trauernicht, David Paul Rochester, US 24 131

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Apr 20, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00