Importance

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Abstract

A substrate plating jig including a first plate-shaped holding member and a second holding member including a ring-shaped seal packing, including an internal circumferential part, an external circumferential part, and an opening formed at the center of the ring-shaped seal packing. Leading edges of the internal circumferential part and external circumferential part of the ring-shaped seal packing come in close contact with a substrate surface-to-be plated and the first holding member, respectively. The edge of the substrate-to-be-plated is held between the internal circumferential part and the external circumferential part of the ring-shaped seal packing. The substrate surface-to-be-plated is exposed in the opening. A first ring-shaped conducting member includes multiple protruding contact points inside the ring-shaped seal packing, and the substrate surface-to-be-plated comes in contact with the protruding contact points inside the ring-shaped seal packing by interposing and clamping the substrate-to-be-plated between the first holding member and the second holding member.

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First Claim