Thermally-conductive sheet, LED mounting substrate, and LED module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9153761
APP PUB NO 20140252404A1
SERIAL NO

14352445

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a thermally-conductive sheet excellent in heat dissipation properties. The thermally-conductive sheet includes a polymer matrix and a thermally-conductive filler dispersed in the polymer matrix. The present invention is a thermally-conductive sheet including a polymer matrix and non-spherical particles of a thermally-conductive filler that are dispersed in the polymer matrix. At least a part of the thermally-conductive filler particles are oriented in a thickness direction of the sheet. When a portion of the sheet where the thermally-conductive filler particles have the highest degree of orientation in the thickness direction of the sheet is defined as a center of orientation, and an axis passing through the center of orientation and perpendicular to sheet surfaces is defined as a central axis of orientation, the thermally-conductive sheet has a region where the thermally-conductive filler particles are oriented toward one point on the central axis of orientation and where the degree of orientation of the thermally-conductive filler particles in the thickness direction of the sheet decreases from the center of orientation toward a periphery of the sheet.

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Patent Owner(s)

  • NITTO DENKO CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hida, Takafumi Osaka, JP 19 48
Kitagawa, Daisuke Osaka, JP 20 66
Kiyohara, Susumu Osaka, JP 6 31
Matsushima, Ryoichi Osaka, JP 44 401
Nagasaki, Kunio Osaka, JP 46 271
Tagawa, Kenichi Osaka, JP 20 587
Takayama, Yoshinari Osaka, JP 22 269
Uota, Toshio Osaka, JP 2 9

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