Semiconductor integrated circuit
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United States of America Patent
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Jul 12, 2016
Grant Date -
Sep 11, 2014
app pub date -
Jul 25, 2013
filing date -
Mar 8, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
In one embodiment, a semiconductor integrated circuit includes power supply strap wires extending in a first direction in a first layer, auxiliary power supply strap wires extending in the first direction in a second layer below the first layer, and intermediate power supply wires each electrically connecting one of the power supply strap wires to one of the auxiliary power supply strap wires in a third layer between the first and second layers. The circuit further includes power supply rails extending in a second direction in a fourth layer below the second layer, and upper power supply strap wires extending in the second direction in a fifth layer above the first layer. An interval between the intermediate power supply wires is larger than an interval between the power supply rails, and is smaller than an interval between the upper power supply strap wires.
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