Devices and methods for connecting device cover components
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United States of America Patent
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Jul 28, 2015
Grant Date -
Sep 11, 2014
app pub date -
Mar 6, 2013
filing date -
Mar 6, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
Devices and methods are provided for connecting device cover components. In general, the devices and methods can allow first and second covers of an electronic device to be connected together at a plurality of attachment points without any gap space between the first and second covers at the attachment points. In an exemplary embodiment, an electronic device can include a housing that has first and second covers attached to one another at a plurality of attachment points. The first cover can be formed from a first material, and the second cover can be formed from a second, different material. The first material can be a softer material than the second material, which can allow the second cover to penetrate into and deform the first cover during manufacturing of the housing such that no gap space is present between the first and second covers at each of the attachment points.
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