Assembly Structure with Filter Device and Printed Circuit Board and Welding Method for Making the Same
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United States of America Patent
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Issued Date -
Sep 11, 2014
app pub date -
Feb 27, 2014
filing date -
Mar 6, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to an assembly structure with filter device and printed circuit board and a welding method for making the same. The welding method is firstly make the metal lines of at least one filter devices be disposed in the metal notches formed on at least one edges of the printed circuit board, and then respectively remove the insulation layers covering the metal lines; therefore, the welding metal lines can be respectively welded with the metal notches after the metal lines and the metal notches are treated with a dip soldering process. Thus, the welding process of the filter device and the printed circuit board can be carried out on the edges of the printed circuit board by simple process procedures; moreover, the fabrication yield of the assembly structure can be effectively increased, and the manufacturing time and cost of the assembly structure can be simultaneously reduced.
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