High Speed Copper Plating Process
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United States of America Patent
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Issued Date -
Sep 11, 2014
app pub date -
Mar 6, 2013
filing date -
Mar 6, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A copper electrolyte comprising a copper nitrate salt is described. The electrolyte is suitable for use in a light induced plating process for metallizing contacts in a photovoltaic solar cell. A method of metallizing an electrical contact in a photovoltaic solar cell using the copper electrolyte is also described.
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