Multilayer Chemical Mechanical Polishing Pad With Broad Spectrum, Endpoint Detection Window

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140256231A1
SERIAL NO

13788814

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A multilayer chemical mechanical polishing pad is provided, having: a polishing layer having a polishing surface, a counterbore opening, a polishing layer interfacial region parallel to the polishing surface; a porous subpad layer having a bottom surface and a porous subpad layer interfacial region parallel to the bottom surface; and, a broad spectrum, endpoint detection window block comprising a cyclic olefin addition polymer; wherein the window block exhibits a uniform chemical composition across its thickness; wherein the polishing layer interfacial region and the porous subpad layer interfacial region form a coextensive region; wherein the multilayer chemical mechanical polishing pad has a through opening that extends from the polishing surface to the bottom surface of the porous subpad layer; wherein the counterbore opening opens on the polishing surface, enlarges the through opening and forms a ledge; and, wherein the window block is disposed within the counterbore opening.

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Patent Owner(s)

Patent OwnerAddress
DOW GLOBAL TECHNOLOGIES LLCMIDLAND MI

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DeGroot, Marty W Middletown, US 48 351
James, David B Newark, US 78 1969
Leugers, Mary A Midland, US 14 277
Repper, Angus Lincoln Univeristy, US 8 59

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