PRESSURE-SENSITIVE ADHESIVE SHEET

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United States of America Patent

APP PUB NO 20140256877A1
SERIAL NO

14200834

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Abstract

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A pressure-sensitive adhesive sheet containing a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer has a melting point of −60° C. to 0° C. The melting point can be measured by using the pressure-sensitive adhesive layer as a measurement sample according to differential scanning calorimetry (DSC) in conformity with JIS K 7121.

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Patent Owner(s)

Patent OwnerAddress
NITTO DENKO CORPORATION1-2 SHIMOHOZUMI 1-CHOME IBARAKI-SHI OSAKA 567-8680

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
FUJITA, Masato Osaka, JP 114 850
MIKI, Kaori Osaka, JP 12 60
NIWA, Masahito Osaka, JP 79 299
NONAKA, Takahiro Osaka, JP 77 334

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