SILICON PLATE IN PLASTIC PACKAGE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140260650A1
SERIAL NO

14022233

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Circuits, methods, and apparatus that provide pressure sensor devices where pressure sensors may be reliably attached to surfaces in device packages, and where the coefficients of expansion of the pressure sensor and the surface are at least approximately equal. Examples may provide pressure sensor devices where pressure sensors may be reliably attached to surfaces in device packages by providing interposers formed to prevent adhesives used to attach the pressure sensors to surfaces from blocking or encroaching into pressure sensor openings or cavities. These same features may be used to accurately locate a pressure sensor relative to the interposer. Embodiments of the present invention may provide pressure sensor devices where the coefficients of expansion of the pressure sensor and the surface are at least approximately equal by proving interposers that are formed of the same or similar material as the pressure sensors, such as silicon.

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Patent Owner(s)

Patent OwnerAddress
SILICON MICROSTRUCTURES INC1701 MCCARTHY BOULEVARD MILPITAS CA 95035

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
August, Richard J Concord, US 9 145
Doering, Holger Sunnyvale, US 8 34
Legaspi, Severino Santa Clara, US 1 1

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