SUBSTRATE CLEANING AND DRYING METHOD AND SUBSTRATE DEVELOPING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20140261571A1
SERIAL NO

14156848

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a substrate cleaning and drying method, including a cleaning step of cleaning a developed substrate by supplying a cleaning liquid to the substrate; a puddle-forming step of forming a puddle of the cleaning liquid on the substrate; a film-thinning step of thinning a film thickness of the cleaning liquid on the substrate; and a drying step of drying the substrate by spinning the substrate and generating outward airflow and inward airflow between the outward airflow and the substrate, the outward airflow covering a portion above the substrate and the inward airflow causing removal of the cleaning liquid on the substrate.

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Patent Owner(s)

Patent OwnerAddress
SCREEN SEMICONDUCTOR SOLUTIONS CO LTD(FORMERLY OF 88 KANKOBOKO-CHO SHIJODORI-MUROMACHI-HIGASHIIRU SHIMOGYO-KU KYOTO JAPAN) TENJINKITA-MACHI 1-1 TERANOUCHI-AGARU 4-CHOME HORIKAWA-DORI KAMIGYO-KU KYOTO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
GOTO, Tomohiro Kyoto-shi, JP 32 150
KASHIYAMA, Masahito Kyoto-shi, JP 21 87
MORITA, Akihiko Kyoto-shi, JP 20 2044
TAKAHASHI, Yasuo Kyoto-shi, JP 109 979

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