AQUEOUS COMPOSITION FOR ETCHING OF COPPER AND COPPER ALLOYS
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United States of America Patent
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Issued Date -
Sep 18, 2014
app pub date -
Nov 8, 2012
filing date -
Nov 21, 2011
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Abandoned
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Abstract
The present invention relates to an aqueous composition and a process for etching of copper and copper alloys. The aqueous composition comprises Fe3+ ions, an acid and a N-alkoxylated polyamide. The aqueous composition is particularly useful for making of fine structures in the manufacture of printed circuit boards, IC substrates and the like.
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