MOLD
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United States of America Patent
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N/A
Issued Date -
Sep 18, 2014
app pub date -
Aug 30, 2012
filing date -
Sep 5, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided is a technology for solving the drawback such as chipping of a heat-insulating layer which is caused by the contact of a heat-insulating layer formed on a first mold with a second mold at the mold parting surface. A mold divided into two or more is provided in which a heat-insulating layer is formed on a substantially entire surface of an inner wall surface of the mold, and the heat-insulating layer does not exist on a mold parting surface. For example, the mold is provided with a first mold occupying a majority of a cavity and a second mold which forms at least a part of the cavity together with the first mold, in which the first mold is provided with a flange part, and a part of a surface of the flange part constitutes a part of the mold parting surface.
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