Adhesive and method of encapsulating organic electronic device using the same

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United States of America Patent

PATENT NO 9105648
APP PUB NO 20140264302A1
SERIAL NO

14289212

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Abstract

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An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.

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Patent Owner(s)

  • LG CHEM, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Suk Ky Daejeon, KR 89 862
Cho, Yoon Gyung Daejeon, KR 64 435
Jeong, Kwang Jin Chungbuk, KR 26 165
Lee, Suk Chin Daejeon, KR 9 40
Shim, Jung Sup Daejeon, KR 45 342
Yoo, Hyun Jee Daejeon, KR 77 474

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