Low CTE interposer without TSV structure

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United States of America Patent

PATENT NO 8884427
SERIAL NO

13828938

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Abstract

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A microelectronic assembly including a dielectric region, a plurality of electrically conductive elements, an encapsulant, and a microelectronic element are provided. The encapsulant may have a coefficient of thermal expansion (CTE) no greater than twice a CTE associated with at least one of the dielectric region or the microelectronic element.

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Patent Owner(s)

  • INVENSAS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Caskey, Terrence Santa Cruz, US 43 940
Newman, Michael Dublin, US 67 1721
Uzoh, Cyprian Emeka San Jose, US 330 9133
Woychik, Charles G San Jose, US 106 2136

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